| abstract |
An object of the present invention is to provide an epoxy resin composition, a resin sheet obtained using the same, a prepreg, a metal-clad laminate, a printed wiring board, and a semiconductor device, wherein the epoxy resin composition can be used to produce a substrate and / or a resin substrate in which warpage occurring in the heating step of the mounting step is suppressed. The epoxy resin composition of the present invention contains an epoxy resin represented by the following formula (1) and a cyanate compound having two or more cyanooxy groups in the molecule as essential components.n□ (wherein the ratio of (a)(b) is (a)/(b)=1~3; G is a glycidyl group; n is a repeat number, 0~5) |