abstract |
The present invention provides an epoxy resin composition for an electronic material comprising a polyfunctional biphenyl type epoxy resin which is triglycidoxybiphenyl or tetraglycidoxybiphenyl, and at least a hardener or a hardening accelerator One. Further, the present invention provides an epoxy resin composition for an electronic material further comprising a filler, particularly a thermally conductive filler. Moreover, the present invention provides a cured product obtained by hardening an epoxy resin composition for an electronic material, and an electronic member containing the cured product. |