http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201608680-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54486 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2015-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b048780ce953657b76370c8430c2a37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b583ec078cc6418a07f6cbac1aa4114 |
| publicationDate | 2016-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201608680-A |
| titleOfInvention | Sealing material with semiconductor sealing substrate, semiconductor device, and method of manufacturing semiconductor device |
| abstract | The present invention relates to a sealing material with a substrate for semiconductor sealing which can produce a semiconductor device having an excellent appearance and laser marking property.nThe present invention relates to a device mounting surface on which a semiconductor element mounting substrate on which a semiconductor element is mounted, or a sealing material on which a semiconductor sealing substrate is to be sealed once to form an element forming surface of a semiconductor element forming a semiconductor element. The sealing material for the semiconductor sealing substrate is a sealing resin layer having a substrate and an uncured or semi-cured thermosetting resin formed on one surface of the substrate, and the other surface of the substrate In the surface resin layer to be formed, the glossiness of the surface resin layer is a sealing material with a semiconductor sealing substrate characterized by a measurement angle of 60° of 60 or less. |
| priorityDate | 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 127.