http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201607394-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b |
| publicationDate | 2016-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201607394-A |
| titleOfInvention | Manufacturing method of connecting structure |
| abstract | The present invention provides a method of manufacturing a bonded structure that can reduce the amount of change in impedance.nThe method for producing a connection structure according to the present invention includes the steps of: disposing a conductive paste on a surface of the first connection member; and forming a second electrode to be connected to the second electrode on the surface of the conductive paste a step of arranging the two electrodes in a relatively opposed manner; and heating the conductive paste to a temperature equal to or higher than a melting point of the solder particles and a hardening temperature of the thermosetting component, and using the solder portion in the connecting portion to form the first electrode a step of electrically connecting to the second electrode; and making the thickness of the solder portion larger than an average particle diameter of the plurality of solder particles, and setting the thickness of the solder portion to 80 μm or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I780387-B |
| priorityDate | 2014-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.