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filingDate 2015-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49ec2e6cd281893e9d79a6391a93ae4b
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publicationDate 2016-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201606536-A
titleOfInvention Unidirectional metal layer layout using complementary electron beam lithography
abstract A lithography apparatus suitable for complementary electron beam lithography (CEBL) and a method of complementary electron beam lithography are described. In an embodiment, the layout of the metallization layer for the integrated circuit includes a first region having a plurality of first widths and a first pitch and unidirectional lines parallel to the first direction. The layout also includes a second region having a plurality of second widths and a second pitch parallel to the first direction, the second width and the second pitch being different from the first width and the first spacing. The layout also includes a third region having a plurality of third and third pitches and a unidirectional line parallel to the first direction, the third width and the third pitch being different from the first width and the second width And different from the first pitch and the second pitch.
priorityDate 2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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