Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-30438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-30422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31764 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0453 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0435 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-303 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31762 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3177 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0277 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B10-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F17-30 |
filingDate |
2015-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49ec2e6cd281893e9d79a6391a93ae4b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12d3c6a0a707dec581e8bd82c4bd51f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f90476a2e3bdac6b3b6c14ef74c80abc |
publicationDate |
2016-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201606536-A |
titleOfInvention |
Unidirectional metal layer layout using complementary electron beam lithography |
abstract |
A lithography apparatus suitable for complementary electron beam lithography (CEBL) and a method of complementary electron beam lithography are described. In an embodiment, the layout of the metallization layer for the integrated circuit includes a first region having a plurality of first widths and a first pitch and unidirectional lines parallel to the first direction. The layout also includes a second region having a plurality of second widths and a second pitch parallel to the first direction, the second width and the second pitch being different from the first width and the first spacing. The layout also includes a third region having a plurality of third and third pitches and a unidirectional line parallel to the first direction, the third width and the third pitch being different from the first width and the second width And different from the first pitch and the second pitch. |
priorityDate |
2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |