| abstract |
An object of the present invention is to provide a photosensitive composition which can obtain a cured film which is excellent in reliability even when heated at a low temperature, and which can be patterned by photolithography. The photosensitive composition of the present invention contains a polymerizable monomer having three or more (meth)acrylonium groups and one or more carboxyl groups in the molecule as component A, and a molecule as component B. a polymerizable monomer having three or more (meth)acrylinyl groups and having no carboxyl group, a photopolymerization initiator as component C, a solvent as component D, a blocked isocyanate compound as component N, and The polymerization inhibitor of the component K, and the content of the component A is 10% by mass to 50% by mass based on the total content of the component A and the component B. |