| abstract |
According to one embodiment of the present invention, there is provided a method for depositing a metal on a reactive metal film on a workpiece, the method comprising: using a plating electrolyte and applying a cathode in a range from about -0.5 V to about -4 V The potential is to electrochemically deposit a metallization layer on the seed layer formed on the workpiece, the plating electrolyte having at least one plated metal ion and a pH range of from about 1 to about 6. Wherein the workpiece comprises a barrier layer disposed between the seed layer and the dielectric surface of the workpiece, the barrier layer comprising a first metal, the first metal having a more negative standard than 0V The electrode potential, and the seed layer comprises a second metal having a standard electrode potential that is more positive than 0V. |