| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate |
2015-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9a05f507df5e833e72d83725bfa8cc2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_460aec512c434c58c5443187b75d88d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5bb9977fa95a702752def9ec1f82298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39c6e73983b7b0926d6cf54503db1b93 |
| publicationDate |
2016-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201602324-A |
| titleOfInvention |
Mixed abrasive tungsten chemical mechanical polishing (CMP) composition |
| abstract |
The present invention relates to a chemical mechanical polishing composition for polishing a substrate having a tungsten layer, the composition comprising a water-based liquid carrier, first and second colloidal cerium oxide abrasives dispersed in the liquid carrier And iron-containing accelerators. The first colloidal ceria abrasive and the second colloidal ceria abrasive each have a permanent positive charge of at least 10 mV. The second ceria abrasive has an average particle size that is at least 20 nm greater than the average particle size of the first ceria abrasive. Further disclosed is a method of chemical mechanical polishing of a substrate comprising a tungsten layer. The method can include contacting the substrate with the polishing composition, moving the polishing composition relative to the substrate, and grinding the substrate to remove a portion of the tungsten from the substrate and thereby polishing the substrate. |
| priorityDate |
2014-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |