| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2015-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb5c46e949ffc8c3c8a53b81339ab0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d |
| publicationDate |
2016-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201602305-A |
| titleOfInvention |
Sheet-like resin composition and method of manufacturing semiconductor device |
| abstract |
The present invention provides a sheet-like resin composition for easily performing alignment for mounting semiconductor elements without changing a conventional process, and a method of manufacturing a semiconductor device using the same. The present invention relates to a sheet-like resin composition for filling a space between an adherend and a semiconductor element electrically connected to the adherend, and has a parallel transmittance of 10% or more. The haze of the sheet-like resin composition is preferably 80% or less. The sheet-like resin composition preferably has a transmittance of 15% or more at a wavelength of 580 nm. |
| priorityDate |
2014-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |