| abstract |
A composition of a film which is excellent in storage stability, coatability and hardenability, low in water absorbability, and excellent in heat resistance, a laminate for underfill, a laminate using the same, a method for producing a semiconductor device, and a semiconductor device are provided.nThe composition contains a polycarbonate resin, a polymerizable compound, and a solvent, and contains 50% by mass or more of a solvent in the composition, and 50% by mass or more of the solvent is an aprotic solvent having a boiling point of 130 ° C or more and a molecular weight of 75 or more. . The polycarbonate resin preferably has a repeating unit represented by the formula (1). In the formula (1), Ar1 and Ar2 each independently represent an aromatic group, and L represents a single bond or a divalent linking group.n□ |