| abstract |
The invention discloses a low dielectric composite material and a laminated board and a circuit board prepared therefrom. The composite material is prepared by attaching a low dielectric resin composition containing a phosphorus flame retardant to a substrate; the composition comprising: (A) a phosphorus-containing flame retardant; (B) a vinyl compound. The phosphorus-containing flame retardant has a structure as shown in the formula (I). □ In the present invention, the phosphorus-containing flame retardant obtained by derivatization of diphenylphosphorus oxide does not have a reactive functional group, and the resin composition obtained by using a vinyl compound can have a lower thermal expansion rate and higher heat resistance. Composites with higher glass transition temperature and lower dielectric constant and dielectric loss, and can produce laminates and circuits with high glass transition temperature, low dielectric properties, halogen-free flame retardancy, and low substrate thermal expansion coefficient board. |