| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76817 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97eda3b68efb8b05786fc55e6b612a18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f89a4af39dd9dacc3355fd95ae0168a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 |
| publicationDate |
2016-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201601608-A |
| titleOfInvention |
Photosensitive dry film and method of manufacturing printed wiring board using the same |
| abstract |
The present invention provides a photosensitive dry film which can form a solder resist layer which is excellent in filling property of an underfill and which is excellent in adhesion to a mold material.nThe photosensitive dry film of the present invention is characterized by comprising a support film and a photosensitive dry film provided on a photosensitive resin layer provided on one surface of the support film, and an arithmetic mean surface of the support film on the surface side on which the photosensitive resin layer is provided The roughness Ra is 50 to 390 nm. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I776613-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I776614-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I751601-B |
| priorityDate |
2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |