| abstract |
Providing a method of fabricating a thermal interposer using low stress photopatternable polyxylene for the production of electronic products that are fed to LEDs, logic and memory components, and other semiconductor products that require thermal management In the package. The photo-patterned polyfluorene composition, the thermally conductive material, and the low melting point compatible solder form a complete semiconductor package module. A photopatternable polyoxymethylene is applied to the surface of the wafer and selectively illuminated to form an opening that provides user-defined adhesion line thickness control. The openings are then filled with a highly conductive paste to form a highly conductive thermal connection. Thereafter applying a low melting point curable solder, wherein the solder wets the polyfluorene oxide and the thermally conductive path, resulting in a low contact thermal resistance between the constructed z-axis thermal interposer and the heat sink and/or substrate, the substrate It can be a wafer or a PCB. |