abstract |
The present invention provides a photocurable thermosetting resin composition, a dry film, a cured product, and a printed circuit board for producing a printed wiring board. The photocurable thermosetting resin composition for producing a printed circuit board is characterized by comprising: (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a photosensitive monomer, and (D) A thermosetting component and (E) a hollow filler. |