http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201547363-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a701a5f5291300f9043560b40127adf3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
filingDate 2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9afc547b47e0eb59a30fb6a9dbad2ccd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47b48575109ae732d9d57a24f3b8959f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cbf49d4dd82967f806084ac9595d2a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e42f71fa61fb49becc4e603c5824bc65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf0c93787ed0a3b90c8f4137031405b8
publicationDate 2015-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201547363-A
titleOfInvention Mobile phone cooling module
abstract A mobile phone heat dissipation module is mainly composed of a heat generating chip, a flat heat pipe and a thermal buffer material, wherein the heat generating chip refers to an arithmetic processor of an integrated circuit provided on a circuit board of the mobile phone; The heat absorbing section is the heat absorbing section, and the heat absorbing section is attached to the heat generating wafer for conducting the heat energy of the heat generating wafer to be quickly conducted to the heat dissipating section at the other end; The heat buffering material is attached or covered at the heat dissipating section of the flat heat pipe, and the outer surface of the thermal buffering material is in contact with the casing of the mobile phone, so that the absorption is conducted to the heat dissipating section. The heat energy is gradually released to the mobile phone case.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111246705-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106028741-A
priorityDate 2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5462224
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707770
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559288
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454515466
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452381074
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419525060
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6336982
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559214
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14829
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID26042
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10176082
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557046
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491185
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23925
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559552
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491805
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90455
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451818717
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID170190
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14792
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359367
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14945
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559503
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14778
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453694953
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577487

Total number of triples: 49.