http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201547335-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate | 2015-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e839e8a777d3d0b1a057f93a0b23ac4f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66dd8c9ab93194ac37aa952d6d8ca690 |
| publicationDate | 2015-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201547335-A |
| titleOfInvention | Surface-treated copper foil, copper foil with carrier, laminated body, printed wiring board, electronic device, method for producing surface-treated copper foil, and method for producing printed wiring board |
| abstract | The present invention provides a surface-treated copper foil which is excellent in peel strength and can satisfactorily suppress transmission loss even when used for a high-frequency circuit substrate. The surface-treated copper foil of the present invention has, in order, a copper foil, a metal layer containing one or more elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface treatment formed of chromium oxide. In the layer, the total amount of the elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr in the metal layer is 200 to 2000 μg/dm 2 , and heat treatment is applied at 250 ° C for 10 minutes to expose only the surface. The state of the surface of the treated layer was immersed in a nitric acid bath having a concentration of 20 mass% and a temperature of 25 ° C for 30 seconds, and the elution amount of copper in the nitric acid bath was 0.0030 g / 25 cm 2 or less. |
| priorityDate | 2014-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.