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publicationDate 2015-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201546984-A
titleOfInvention Straight-through twinning and intermediate structure with reduced stress
abstract A component can include a substrate and a conductive via extending in an opening in the substrate. The substrate can have first and second opposing surfaces. The opening may extend from the first surface toward the second surface and may have an inner sidewall extending away from the first surface. A dielectric material can be exposed at the inner sidewall. The electrically conductive perforations may define a reduced pressure passage within the opening adjacent the first surface. The reduced pressure passage may have an edge within a first distance from the inner side wall in a direction parallel to the plane of the first surface and within 5 micrometers below the first surface, the first distance being The smaller of 1 micron and the opening is one of the largest widths of one of the planes. The edge may extend along the inner sidewall to span at least five percent of the circumference of the inner sidewall.
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