| abstract |
A semiconductor device structure and a method of forming the same are provided. The semiconductor device structure includes a semiconductor substrate and a dielectric layer on the semiconductor substrate. The semiconductor device structure also includes conductive traces on the dielectric layer. The semiconductor component structure further includes a conductive member on the conductive line, and the width of the conductive member is substantially equal to or greater than a maximum width of the conductive line. Further, the semiconductor device structure includes conductive bumps on the conductive member. |