http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201544309-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b1360101f80233fa3480c9b51491c22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bde6c4677ade57d6a6b6e34ed1356ec0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7df826607bc3f67fde417d673f2e1b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64399ef4ace976a882d03b5ab9335222 |
| publicationDate | 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201544309-A |
| titleOfInvention | Copper foil for transparent resin substrate and transparent resin substrate with fine copper wiring |
| abstract | An object of the present invention is to provide a copper foil for a transparent resin substrate, a transparent resin substrate with fine wiring, and a method for producing a transparent resin substrate with fine wiring, the transparent resin substrate copper foil and a transparent resin substrate thereof The surface has high scratch resistance and acid resistance, and is suitable for forming extremely fine copper wiring with high antireflection effect.nIn order to solve the problem, a copper foil for a transparent resin substrate having a feature of forming a copper wiring for a transparent resin substrate on the surface of a transparent resin substrate is provided with a fine uneven structure layer on the surface of the copper foil. The fine concavo-convex structure layer contains cuprous oxide and copper oxide, and has a fine concavo-convex structure formed of the copper composite compound and having a needle-like or plate-like convex portion having a maximum length of 500 nm or less. |
| priorityDate | 2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.