| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-3584
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-386 |
| filingDate |
2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f28ca0f72a88cff1709b6c404af8983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d87d7b9ad64f60e219422dda68a53b90 |
| publicationDate |
2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201542351-A |
| titleOfInvention |
Roughening copper foil, copper clad laminate and printed circuit board |
| abstract |
Provided a roughened copper foil for laser drilling processing having a roughened surface suitable for laser drilling and a roughened surface having excellent adhesion to an insulating layer material, and used A copper clad laminate for roughening copper foil, and a printed circuit board for the purpose.nIn order to achieve the object, there is provided a roughening of a fine concavo-convex structure formed by a convex portion having a needle shape or a plate shape having a maximum length of 500 nm or less formed of a copper composite compound containing copper oxide on both sides of a copper foil. In the processing surface, one of the surfaces of the copper foil is a laser irradiation surface that is irradiated with laser light during laser processing, and the other surface is a roughened copper for laser opening processing on the surface of the insulating layer. Foil. Further, a copper clad laminate and a printed circuit board using the copper foil for laser drilling are provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I703909-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I616336-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I723835-B |
| priorityDate |
2014-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |