| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate |
2015-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2ad7bdcf2388e57381d9c062c4fbbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a590ab99d1c027a6941aa93eae69fa4e |
| publicationDate |
2015-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201542047-A |
| titleOfInvention |
Copper foil with printed carrier, printed wiring board, laminated body, electronic device, and printed wiring board manufacturing method |
| abstract |
The present invention provides a copper foil with a carrier having good circuit formation properties. The copper foil with a carrier of the present invention is provided with a carrier, an intermediate layer, and an extremely thin copper layer in this order, and the amount of water generated when the copper foil with a carrier is heated to 500 ° C at 30 ° C / min is 160 ppm / g or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I626322-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I697573-B |
| priorityDate |
2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |