http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201542041-A

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filingDate 2015-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201542041-A
titleOfInvention Cooling frame lift and low contact shadow ring for plasma thermal isolation
abstract Described herein are methods and apparatus for dicing semiconductor wafers having a plurality of integrated circuits on each wafer. In one example, a frame lift assembly for a plasma processing chamber includes a draw single ring having an upper surface for supporting a frame of the substrate support and for cooling the With box. The frame lift assembly also includes one or more lift lift arms for moving the capture single loop to and from the transfer position and processing position. The frame assembly also includes one or more lift lift plate portions, one draw lift plate portion corresponding to one draw lift arm, and the one or more draw lift plate portions for One or more extraction lift arms are coupled to the capture single ring.
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priorityDate 2014-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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