http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201540504-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate | 2015-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53800db7955f6f447cb4dc0c65d880c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d142c58eddaadf026d954f512b43d5c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15b2bc043e6accf4a0c3adb6a9a1aba0 |
| publicationDate | 2015-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201540504-A |
| titleOfInvention | Resin film |
| abstract | The present invention provides a resin film comprising a thermoplastic resin layer and a curable resin layer, and is excellent in heat resistance and yellowing resistance.nThe resin film of the present invention comprises: a thermoplastic resin layer formed of a thermoplastic resin; and a curable resin layer disposed on the thermoplastic resin layer, the glass transition temperature of the thermoplastic resin being 250 ° C or higher, and the total light transmission of the thermoplastic resin layer When the rate is 85% or more, the hue change in the case where the thermoplastic resin layer is heated from 25 ° C to 250 ° C in air is 2 or less in terms of a h color b value, and the curable resin layer is made to contain a curable monomer. And the curable resin composition of the curable resin composition is cured, and the solvent content ratio in the curable resin composition is 1% by weight or less based on the total amount of the curable resin composition, and the curability is The storage elastic modulus of the resin layer at 250 ° C was 20% or more with respect to the storage elastic modulus at 30 ° C. |
| priorityDate | 2014-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.