http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201540144-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| filingDate | 2015-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93bd50287fe3757584a650043bab7b72 |
| publicationDate | 2015-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201540144-A |
| titleOfInvention | Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, circuit-formed substrate for semiconductor package, semiconductor package, and printed wiring board manufacturing method |
| abstract | The present invention provides a structure in which, after the resin substrate is bonded to a copper foil, the copper foil is removed from the resin substrate without etching, and the contour of the surface of the copper foil transferred onto the surface of the resin substrate is not damaged, which can provide a good cost. Surface treated copper foil with copper foil removed. The surface-treated copper foil of the present invention comprises: a copper foil having surface irregularities or a copper foil having roughened particles having an Rz of 0.1 to 5.0 μm as measured according to JIS B0601 (1994); The surface of the copper foil having the surface unevenness of the copper foil or the surface of the copper foil having the roughened particles, and the release of the resin substrate when the resin substrate is bonded to the copper foil from the release layer side is released. Floor. |
| priorityDate | 2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 293.