| abstract |
A semiconductor structure is provided in an embodiment. The semiconductor structure includes a first substrate and a metal pad formed on the first substrate. The semiconductor structure further includes an improved conductor post having a top portion and a bottom portion formed on the metal pad and a solder layer formed on the modified conductor post. Further, the top portion of the modified conductor post has a first side wall in a first direction, and the bottom portion of the modified conductor post has a second side wall that is different from the first direction in a second direction. |