| abstract |
A method of forming an electronic device, comprising: (a) providing a substrate comprising one or more layers to be patterned; (b) forming a photoresist layer on the one or more layers to be patterned, wherein The photoresist layer is formed from a composition comprising: a matrix polymer comprising a unit having an acid labile group; a photoacid generator; and an organic solvent; (c) coating the photoresist overcoat composition The photoresist layer, wherein the overcoat composition comprises a quenching polymer and an organic solvent, wherein the quenching polymer comprises a unit having a basic portion, the basic portion being effectively neutralized in the photoresist layer (d) exposing the photoresist layer to activating radiation; (e) heating the substrate in a post-exposure bake process; and (f) using an organic solvent; The developer develops the exposed film. This method is particularly useful in the semiconductor manufacturing industry. |