http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201538804-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2015-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c644096b7bfa2cda1ab60fda3456d59e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef0bfb838c9f3b1327d76ee22f743b9 |
| publicationDate | 2015-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201538804-A |
| titleOfInvention | Method and apparatus for electroplating and seed layer detection |
| abstract | The present invention discloses a method and apparatus for detecting a seed layer for electroplating. The methods and associated devices operate by: selecting a wafer for processing; measuring a color signal in one or more processes having one or more color components from its surface; calculating one or more metrics, each A metric represents a difference between one of the process color and a set of corresponding reference color signals; determining the crystal according to whether a predetermined number of the one or more metrics fall within a relevant preset range corresponding to the respective metrics Whether the circular surface is acceptable for the presence of a seed layer; and plating the wafer when an acceptable seed layer is present or designating the wafer to be unacceptable for plating. The above may be repeated for one or more additional wafers to plate a plurality of wafers of a set of wafers. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I743176-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I742934-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11682114-B2 |
| priorityDate | 2014-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 25.