| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
2015-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d53c451bb21949d0cbea68f68674ea7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14cb090c8c2ff364393f9c5a9003d91e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3989a0c95266d09c576f49e00692b17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3d890b8fa5b85413f6dc2b746e08cce |
| publicationDate |
2015-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201538787-A |
| titleOfInvention |
Embedded circuit pattern feature selective electroless copper plating technology |
| abstract |
Embodiments of the invention describe selective electroless plating of a dielectric layer. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. Metal is deposited only on the patterned surface of the dielectric layer using electroless plating. According to an embodiment, the dielectric layer is doped with an activator precursor. Performing a laser-assisted local activation reaction on the patterned surfaces of the dielectric layer to select only on the patterned surfaces of the dielectric layer by reducing the activator precursor to a zero oxidation state Form a seed layer. According to another embodiment, a colloidal or ion seeding solution is used to selectively form a seed layer on the patterned surfaces of the dielectric layer. |
| priorityDate |
2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |