| abstract |
The present invention provides a curable resin composition, a composition for forming a permanent film, and a composition of a cured film which is excellent in adhesion to a substrate forming material such as an underfill, without lowering other characteristics. Film and printed circuit board.nThe curable resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) an inorganic filler, (C) a thermosetting component, and (D) a photopolymerization initiator, wherein the above ( A) The carboxyl group-containing resin is a carboxyl group-containing resin having a phenolic skeleton, and the (C) thermosetting component contains a maleic imine compound. |