| abstract |
The present invention provides a chip package including a semiconductor wafer, at least one trench, a plurality of first redistributed metal lines, and at least one bump. The semiconductor wafer has a plurality of conductive pads disposed on an upper surface of the semiconductor wafer. The trench extends from the upper surface toward the lower surface of the semiconductor wafer, and the trench is disposed on a side of the semiconductor wafer. A plurality of first re-layout metal lines are disposed on the upper surface, and the first re-layout metal lines are electrically connected to the conductive pads, respectively, and the first re-layout metal lines respectively extend into the trenches. The protrusions are disposed in the trenches and between the adjacent first redistribution metal lines. |