| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2015-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dad8bae74be06b33bc72bba5eb59da65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b |
| publicationDate |
2015-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201536892-A |
| titleOfInvention |
Conductive paste, connection structure, and manufacturing method of connection structure |
| abstract |
The present invention provides a conductive paste which can efficiently dispose solder particles on an electrode and improve the conduction reliability between electrodes.nThe conductive paste of the present invention contains a thermosetting component and a plurality of solder particles, and when the thermosetting component and the solder particles are heated at a temperature increase rate of 10 ° C/min and the differential scanning calorimetry is performed, the thermosetting component is The exothermic peak temperature in the formal hardening is higher than the endothermic peak top temperature in the melting of the solder particles, and the exothermic peak top temperature in the main hardening of the thermosetting component and the endothermic peak top temperature in the melting of the solder particles The absolute value of the difference is 10 ° C or more and 70 ° C or less. |
| priorityDate |
2014-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |