http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201534705-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2015-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa639f1753be2d0a9575104e81ffa335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a6a886ab5a55f85b8a6ece965546e05 |
| publicationDate | 2015-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201534705-A |
| titleOfInvention | Abrasive grain for polishing, manufacturing method thereof, polishing method, polishing device and slurry |
| abstract | An object of the present invention is to polish the surface of a material to be polished with high polishing speed at a high polishing rate.nIn the present invention, the material to be polished is ground by a wet grinding method. The slurry is obtained by dispersing abrasive grains for polishing in pure water. The abrasive grains for polishing are integrated into a particle shape by a component that exhibits mechanochemical action or a component that reacts with frictional heat generated when the material to be polished is polished. Each component is in a state in which the properties inherent to the materials of the respective components are maintained, and are directly bonded to each other by mechanical alloying treatment. When the slurry is used in a rubbing step such as sapphire or tantalum carbide or gallium nitride, the polishing time can be significantly shortened in the past, and the processing cost can be greatly improved. The polished surface is of high quality. The abrasive particles for grinding can be reused in the grinding process. Since the pH of the slurry is about 3 to 9, it does not affect the environment of the grinding work, and the disposal of the waste liquid is also simple. |
| priorityDate | 2014-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.