| abstract |
An integrated circuit structure comprising a substrate, a post-passivation interconnect structure, a solder region, and a mold compound, wherein the post-passivation interconnect structure is on a substrate, and the solder region is on a portion of the post-passivation interconnect structure and is electrically connected to A portion of the post-passivation interconnect structure in which the lower portion of the molding compound shaped solder region is. The top surface of the mold compound is higher or lower than the maximum diameter plane, wherein the largest diameter plane is parallel to the major surface of the substrate, and wherein the largest diameter of the solder region is in the largest diameter plane. |