| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2014-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3881960f8fe80c901fa14a105bb23a01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bd16b2f21cad3448fc8ba19e432edd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f70499ce6fb1f64b911008b815b197ca |
| publicationDate |
2015-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201533458-A |
| titleOfInvention |
Metal-clad laminate, circuit board and electronic device |
| abstract |
The metal-clad laminate (100) of the present invention has an insulating layer (101) containing an epoxy resin composition and a fibrous substrate, and a metal foil (103) on both surfaces of the insulating layer (101). Further, the metal-clad laminate (100) is subjected to etching to remove the metal foil (103) on both sides, and then continuously subjected to a temperature-increasing process from 30 ° C to 230 ° C and from 230 ° C using a thermomechanical analyzer. The first thermomechanical analysis (1stRun) consisting of a cooling process up to 30 °C, and (2) the second thermomechanical process consisting of a temperature rising process from 30 ° C to 230 ° C and a cooling process from 230 ° C to 30 ° C In the thermomechanical analysis of the analysis and measurement (2ndRun), the average linear expansion coefficient α1 in the thickness direction of the insulating layer (101) is 10 ppm/° C. or more and 100 ppm/° C. or less, and the average linear expansion coefficient α2 is 100 ppm/° C. or more and 220 ppm. / °C below. Α1 is the average linear expansion coefficient calculated in the range of 50 ° C to 100 ° C in the second heating process, and α 2 is the average linear expansion calculated in the range of 210 ° C to 230 ° C in the second heating process. coefficient. |
| priorityDate |
2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |