abstract |
The present invention provides a printed circuit board and a method of fabricating the same. The printed circuit board includes an adhesive film disposed between the insulating layer and the circuit pattern, wherein the adhesive film comprises polyglycidyl methacrylate. The printed circuit board may include an adhesive film between the circuit pattern and the insulating layer, thereby improving the adhesion strength while having a low roughness value, forming a fine circuit pattern, and enhancing the reliability. |