| abstract |
Provided herein are compositions that have a good balance between cure speed, clarity, tack and/or melt viscosity. In one aspect, a composition comprising a nanoparticle filler and its use in the preparation of various electronic components (eg, a three-dimensional integrated circuit) are provided. In some aspects, a three-dimensional integrated circuit prepared using the composition of the present invention (i.e., a composition containing a nanoparticulate filler), and a method of preparing the same, and the resulting three-dimensional integrated circuit are provided. In some aspects, methods of improving the cure speed, clarity, tack and/or melt viscosity of the pre-coated underfill composition are also provided. In some aspects, a pre-coated underfill composition having improved processability is also provided. |