http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201531172-A

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filingDate 2014-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9ef2de8b4a88550e85493ca4e7b7add
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc956791e10dbbfebd72c1da10b98d3f
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publicationDate 2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201531172-A
titleOfInvention Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method
abstract The present invention provides a surface-treated copper foil excellent in transparency of a resin obtained by removing copper foil by etching. The surface-treated copper foil of the present invention is surface-treated separately on one surface and the other surface. After bonding one surface side to both sides of the polyimide film, the copper foil on both sides is removed by etching, and when the printed matter of the printed mark is printed, the obtained observation point-brightness chart is as follows (1) The Sv of the formula is 3.5 or more, and Sv=(△B×0.1)/(t1-t2) (1)nThe ten-point average roughness Rz of the TD measured by a laser microscope having a laser light wavelength of 405 nm on the surface of the surface-treated copper foil is 0.35 μm or more.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I660651-B
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priorityDate 2013-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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