| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5ebd9bdc11f7a4b267d7e865d5a84f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 |
| filingDate |
2014-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c31e40d2f34c3c74fcb4852510e87cb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02d8d2e745ebc5a2e9a783243eade3a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0275a9c4e5abb67404f9604d0ab449dc |
| publicationDate |
2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201531025-A |
| titleOfInvention |
Electronic device and method of manufacturing electronic device |
| abstract |
An electronic device that prevents corrosion of the through electrode by preventing intrusion of moisture and that can relieve stress of the base substrate can be provided.nAn electronic device according to the present invention includes an insulating base substrate on which a plurality of through electrodes are formed, and an electronic component that is electrically connected to the through electrode and is attached to one surface of the base substrate, and houses the electronic component, and is bonded to the base a cover body on the one surface of the base substrate and an outer surface of the through electrode exposed from the other surface of the base substrate covering the other surface around the end surface; the outer portion The electrode includes a conductive film covering the other surface around the end surface from the end surface, a first electrolytic plating film formed on the surface of the conductive film by electrolytic plating, and an electrolytic plating method. The second electrolytic plating film formed on the surface of the first electrolytic plating film; the second electrolytic plating film is formed of tin or a tin alloy. |
| priorityDate |
2013-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |