| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 |
| filingDate |
2015-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5e9d06fc952bb3c0130263ed918624f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e2927c2a25d11f1201e0bdb43b67f12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0229a3d3ba4ca9727ea5d907ff654ed1 |
| publicationDate |
2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201530755-A |
| titleOfInvention |
Semiconductor device and method of manufacturing the same |
| abstract |
According to this embodiment, a semiconductor device is provided. The semiconductor device includes a through hole, a copper layer, and a metal portion. The through holes penetrate the front and back surfaces of the semiconductor substrate. The copper layer is formed inside the through hole. The metal portion is formed of a metal other than copper on the side of the core of the through hole than the copper layer, and encloses a cavity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I801811-B |
| priorityDate |
2014-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |