patent/TW-201530706-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201530706-A

Outgoing Links

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assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d4873a450897adf395a3b9d42da0ced3
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-26175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3841 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10175 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
filingDate	2014-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e0198d0b8e37c14b41ca90129a15e5a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f415b76194f89731429bc6c80c988339
publicationDate	2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201530706-A
titleOfInvention	Copper-clad substrate with barrier structure and method of manufacturing same
abstract	A copper-clad substrate having a barrier structure includes a plurality of load-bearing regions and a plurality of barrier regions, each of which is electrically connected to each of the wafers, and each of the barrier regions is formed around each of the load-bearing regions. Thereby, the barrier region of the present invention can avoid the problem of short circuit caused by contact with other signal lines after the tin sheet is formed into liquid tin in the reflow furnace.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113725190-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I804873-B
priorityDate	2014-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 41.