| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32c6b57b90395f5fd6b4b2549dc263f4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2015-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_836e455899ea7e97159b31e4f5382da2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aab49d07b9fc4ba8b753f787f934f4e6 |
| publicationDate |
2015-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201530666-A |
| titleOfInvention |
Manufacturing method of semiconductor package, and using non-contact up-spray system to manufacture semiconductor package |
| abstract |
The present invention relates to a method of fabricating a semiconductor package comprising the steps of: (a) providing a semiconductor wafer having a bottom surface to which one or more solder joints are attached; and (b) a non-contact upward jetting system, Coating a curable epoxy resin mixture onto at least a portion of the bottom surface of the semiconductor wafer and/or at least one solder joint by upward spraying; (c) placing the covered semiconductor wafer on a circuit board or a carrier And (d) coupling one or more solder joints to the circuit board or the carrier substrate and curing the curable epoxy resin mixture. The invention is more related to the use of a non-contact upward jet system to fabricate a semiconductor package. |
| priorityDate |
2014-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |