| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate |
2014-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b6c0844a3e945d890dbc2d54db463e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b0dad22acb5b4f946ae89c8ba6ef11 |
| publicationDate |
2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201527361-A |
| titleOfInvention |
Phenolic resin, epoxy resin, epoxy resin composition, prepreg and cured product thereof |
| abstract |
An object of the present invention is to provide a resin and a cured product thereof which satisfy thermal conductivity, heat resistance and solvent solubility. The phenol resin of the present invention is obtained by condensing a phenol compound represented by the following formula (1) with a polymethylphenyl phenyl derivative represented by the following formula (2), which is in GPC (gel permeation). The weight average molecular weight measured in the chromatographic method is 500 to 3,000 g/eq.n□□ (wherein R1 and R2 represent hydrogen atoms, etc., and n represents a positive number of 2 to 5). |
| priorityDate |
2013-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |