| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf83328d853bc7476ca10212837b3a01 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13565 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2014-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f4e20ee48f817a28c13892e76fad311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81f42f2f32861a683f5de23e36d3164c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da68f8e0a863f5bf149c783c8d5fd36d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b3326cfbf61a70f7f68a8d24aa7690c |
| publicationDate |
2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201526186-A |
| titleOfInvention |
Integrated circuit including copper pillar structure and manufacturing method thereof |
| abstract |
The invention discloses an integrated circuit comprising a copper pillar structure and a manufacturing method thereof. In an exemplary embodiment, the integrated circuit includes a final metal layer and a passivation layer disposed over the last metal layer. The final metal layer and the passivation layer are disposed on the active circuit active device formed on the semiconductor substrate. . The integrated circuit further includes a copper pillar structure partially disposed within the first portion of the passivation layer and directly over the last metal layer. The first portion of the passivation layer is defined by the first and second sidewalls of the passivation layer and the upper surface of the final metal layer. The copper pillar structure includes a liner formed over the first and second sidewalls and the upper surface of the last metal layer and a copper material within the liner. The copper post structure including the liner and the copper material in the liner further extends to a height above the upper surface of the passivation layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11031382-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I783191-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I572257-B |
| priorityDate |
2013-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |