http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201524280-A

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filingDate 2014-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df
publicationDate 2015-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201524280-A
titleOfInvention Surface treatment copper foil, laminated board, printed wiring board, electronic device, copper foil with carrier, and printed wiring board manufacturing method
abstract Provided is a surface-treated copper foil which is excellent in transmission loss even when used for a high-frequency circuit substrate. A surface-treated copper foil having a surface treatment layer formed on at least one surface thereof, a total adhesion amount of Co, Ni, and Fe in the surface treatment layer is 1000 μg/dm 2 or less, and the surface treatment layer has a Zn metal layer or an alloy treatment layer containing Zn. The surface treatment layer surface has a ratio of a three-dimensional surface area measured by a laser microscope to a two-dimensional surface area of 1.0 to 1.9, and at least one surface has a surface roughness Rz JIS of 2.2 μm or less.
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priorityDate 2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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