http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201523141-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate | 2014-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67bb7e11a67f943ff3e37ed7f32a6d26 |
| publicationDate | 2015-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201523141-A |
| titleOfInvention | Photohardening thermosetting resin composition, cured product, and printed wiring board |
| abstract | A photocurable thermosetting resin composition comprising (A) a carboxyl group-containing resin, (B) a polyfunctional epoxy resin having a softening point of 60 ° C or less, and (B') a polyfunctional group having a softening point of more than 60 ° C A photocurable thermosetting resin composition of an epoxy resin, (C) a photopolymerization initiator, and (D) a colorant, wherein (B) a polyfunctional epoxy resin having a softening point of 60 ° C or less The total number of epoxy groups (B'1) of the epoxy group (B1) and the polyfunctional epoxy resin having a softening point of (B') of more than 60 ° C is 1 equivalent of the carboxyl group of the resin containing (A) carboxyl group. A dry coating film having a film thickness of 20 μm formed using the photocurable thermosetting resin composition described above, having a thickness of 0.8 equivalent or more and 2.2 equivalent or less, has a transmittance of 25% or less at a wavelength of 600 nm. |
| priorityDate | 2013-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 175.