| abstract |
The invention relates to a method for providing a copper seed layer on top of a barrier layer, wherein the seed layer is deposited on the barrier layer from an aqueous electroless copper plating bath containing Cu(II) ions a water-soluble source, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions, and at least one source of hydroxide ions selected from the group consisting of RbOH, CsOH, and mixtures thereof. The resulting copper seed layer has a uniform thickness distribution and a smooth outer surface, all of which are desirable characteristics. |