| abstract |
The invention relates to a blend comprising at least one organic semiconductor compound (OSC) having a molecular weight of up to 5000 gram/mol, at least one organic solvent and at least one polymer having a weight average molecular weight of at least 5.000.000 g/mole An adhesive, wherein the blend comprises a viscosity of at least 15 mPas at 25 °C. Furthermore, the present invention relates to the use of such blends as inks for the preparation of organic electronic (OE) devices, preferably organic photovoltaic (OPV) cells and organic light emitting diode (OLED) devices, using such blends Methods of preparing OE devices, and OE devices, OLED devices, and OPV cells prepared from such methods and blends. |