| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3406 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F214-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F214-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F214-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-68 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2014-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2be46d0c1b1c3ab5867c854bd45587d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d7d7b588381640787bf3b64035a0f07 |
| publicationDate |
2015-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201521989-A |
| titleOfInvention |
Release film and method of manufacturing semiconductor package |
| abstract |
Provided is a release film and a method of producing a semiconductor package using the release film, which has excellent mold release property and can suppress a resin sealing portion caused by a release film or a sealing material when a semiconductor element is sealed with a curable resin The mold is contaminated, and a resin sealing portion excellent in adhesion to the ink layer can be formed.nA release film is disposed in a mold cavity of a mold in a method of manufacturing a semiconductor package, wherein the semiconductor package is formed by disposing a semiconductor element in a mold and sealing with a curable resin to form a resin sealing portion; The release film has a first surface that is in contact with the curable resin and a second surface that is in contact with the cavity surface when the resin sealing portion is formed, and at least the first surface is made of a fluororesin. Further, in the specific test method, F/Al is 0.2 to 4 or F/(C+F+O) is 0.1 to 0.3. |
| priorityDate |
2013-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |