http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201521045-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64f865523ae8fb5ef8dfabb540489ca3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-02 |
| filingDate | 2013-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c4ed2815e16252e4ffdd6c01da9831b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5684798a51d88e1ff25e63c43315c18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f071ab21cbd5fa3881d175680a68a5d7 |
| publicationDate | 2015-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201521045-A |
| titleOfInvention | Overcurrent protection component and its protection circuit board |
| abstract | An overcurrent protection component for soldering to a surface of a circuit board comprising a layer of PTC material, a first electrode foil, a second electrode foil, a solder pad, and a metal connector. The PTC material layer has opposing first and second surfaces, the first electrode foil physically contacting the first surface, and the second electrode foil electrically connecting the second surface of the PTC material layer. The second electrode foil and the bonding pad are both located on the lower surface of the overcurrent protection component, and the soldering region is isolated from the second electrode foil. The metal connector is located on the side surface of the overcurrent protection element. The second electrode foil is used for soldering to an electrode region in the circuit board, and the soldering region and the metal connecting member are used as soldering and fixing corresponding pads in the circuit board. |
| priorityDate | 2013-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.