| abstract |
The present invention discloses a halogen-free epoxy resin composition for IC encapsulation, which comprises a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing curing agent, an inorganic filler, a curing accelerator, and a solvent. The resin having excellent rigidity and toughness contained in the composition, and the inorganic filler impart a low expansion coefficient and excellent heat resistance to the composition, whereby the laminate prepared by the composition is suitable for an IC package substrate, and the above composition The prepared laminate was a halogen-free compound with a flame retardant rating of UL94-V0. |